
Typical Use: | Used for electronic embedment and in sealing or cementing of metals, ceramics and plastics. |
Brand: | STYCAST |
Chemical Composition: | Epoxy |
Color: | Black |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 8 to 24h @ 25 °C; 2h @ 65 °C |
Dielectric Strength: | 16 kV/mm |
Flash Point: | >93.3 °C |
Hardness: | Rigid: 80 D; Semi-rigid: 50 D; Flexible: 60 D |
Mix Ratio: | Rigid: 100:50 by weight; Semi-rigid: 100:100 by weight; Flexible: 100:150 by weight |
Service Temperature: | -70 to 125 °C |
Specific Gravity: | 1.65 |
Thermal Conductivity: | 0.33 W/mK |
Viscosity: | 20,000 to 40,000 |
Volume Resistivity: | >= 1 x 10^13 ohm-cm |
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Typical Use: | Used for electronic embedment and in sealing or cementing of metals, ceramics and plastics. |
Brand: | STYCAST |
Chemical Composition: | Epoxy |
Color: | Black |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 8 to 24h @ 25 °C; 2h @ 65 °C |
Dielectric Strength: | 16 kV/mm |
Flash Point: | >93.3 °C |
Hardness: | Rigid: 80 D; Semi-rigid: 50 D; Flexible: 60 D |
Mix Ratio: | Rigid: 100:50 by weight; Semi-rigid: 100:100 by weight; Flexible: 100:150 by weight |
Service Temperature: | -70 to 125 °C |
Specific Gravity: | 1.65 |
Thermal Conductivity: | 0.33 W/mK |
Viscosity: | 20,000 to 40,000 |
Volume Resistivity: | >= 1 x 10^13 ohm-cm |