Chemtronics 1.5m Desoldering Braid, Width 5.3mm

DESCRIPTION

Soder-Wick® De-soldering Braid

  • De-soldering braid packaged in static dissipative bobbins.
  • Significantly reduces rework/repair time
  • Minimises the risk of damage to the board
  • Patented non-corrosive, halide free, organic no-clean flux
  • BGA desolder braid is designed for removing solder from BGA pads and chips
 

Note

  • Series 50 and Series 82 contain Rosin and Rosin SD
  • Wick & Braid
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Soder-Wick® De-soldering Braid

  • De-soldering braid packaged in static dissipative bobbins.
  • Significantly reduces rework/repair time
  • Minimises the risk of damage to the board
  • Patented non-corrosive, halide free, organic no-clean flux
  • BGA desolder braid is designed for removing solder from BGA pads and chips
 

Note

  • Series 50 and Series 82 contain Rosin and Rosin SD
  • Wick & Braid

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